在拓展18吋先進製程產品的研發技術藍圖發展上,家登所推出的18吋FOUP與450mm MAC V3版,不但具有一體成型的優點、去零件化的設計也大幅降低產品總重量,為終端用戶提升製程良率與協助其降低系統總成本的目標持續優化,截至目前為止,V3版的送樣認證階段陸續與國內外半導體大廠合作進行中,可望在第3季有具體成績,法人預期家登下半年營運回溫將優於上半年。
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